发明授权
- 专利标题： Three-dimensional chip stack and method of forming the same
- 专利标题（中）： 三维芯片堆叠及其形成方法
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申请号： US13544746申请日： 2012-07-09
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公开(公告)号： US08803333B2公开(公告)日： 2014-08-12
- 发明人: Chen-Hua Yu , Da-Yuan Shih , Chih-Hang Tung
- 申请人： Chen-Hua Yu , Da-Yuan Shih , Chih-Hang Tung
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L29/40
- IPC分类号： H01L29/40 ; H01L23/48 ; H01L23/52 ; H01L23/488
摘要：
A three dimensional (3D) chip stack includes a first chip bonded to a second chip. The first chip includes a first bump structure overlying the first substrate, and the second chip includes a second bump structure overlying the second substrate. The first bump structure is attached to the second bump structure, and a joining region is formed between the first bump structure and the second bump structure. The joining region is a solderless region which includes a noble metal.
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