发明授权
- 专利标题： Electronic device enclosure
- 专利标题（中）： 电子设备外壳
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申请号： US13404074申请日： 2012-02-24
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公开(公告)号： US08804335B2公开(公告)日： 2014-08-12
- 发明人: Yun-Lung Chen , Chung Chai , Wei-Yong Ma
- 申请人： Yun-Lung Chen , Chung Chai , Wei-Yong Ma
- 申请人地址： CN Wuhan TW New Taipei
- 专利权人： Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Wuhan TW New Taipei
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 优先权： CN201110147631 20110602
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; G06F1/20
摘要：
The electronic device enclosure includes a case and a cooling assembly. The case includes a top plate, a bottom plate, a side plate and a mounting plate. The top plate is opposite to the bottom plate, and the side plate is substantially perpendicularly connected to the top plate and the bottom plate. The cooling assembly includes a cooler and a fan secured to the cooler. The mounting plate is secured to the top plate and the bottom plate, the fan is secured to the mounting plate and located between the mounting plate and the cooler.
公开/授权文献
- US20120307450A1 ELECTRONIC DEVICE ENCLOSURE 公开/授权日：2012-12-06
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