Invention Grant
- Patent Title: Packaging process tools and packaging methods for semiconductor devices
- Patent Title (中): 半导体器件的封装工艺和封装方法
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Application No.: US13270890Application Date: 2011-10-11
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Publication No.: US08809117B2Publication Date: 2014-08-19
- Inventor: Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
- Applicant: Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwain Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwain Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.
Public/Granted literature
- US20130089952A1 Packaging Process Tools and Packaging Methods for Semiconductor Devices Public/Granted day:2013-04-11
Information query
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