Invention Grant
US08810018B2 Stacked integrated circuit package system with face to face stack configuration 有权
堆叠集成电路封装系统,具有面对面堆叠配置

Stacked integrated circuit package system with face to face stack configuration
Abstract:
A stacked integrated circuit package system is provided forming a first molded chip comprises attaching a conductor on a wafer, applying an encapsulant around the conductor, and exposing a surface of the conductor in the encapsulant, attaching a first electrical interconnect on the conductor of the first molded chip and stacking an integrated circuit device on the first molded chip with an electrical connector of the integrated circuit device connected to the conductor of the first molded chip with the first electrical interconnect.
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