Invention Grant
- Patent Title: Hole transport compositions and related devices and methods (II)
- Patent Title (中): 空运输组合物及相关装置及方法(二)
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Application No.: US13868924Application Date: 2013-04-23
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Publication No.: US08815639B2Publication Date: 2014-08-26
- Inventor: Christopher T. Brown , Neetu Chopra , Christopher Knittel , Mathew Mathai , Venkataramanan Seshadri , Jing Wang , Brian Woodworth
- Applicant: Plextronics, Inc.
- Applicant Address: US NJ Cranbury
- Assignee: Solvay USA, Inc.
- Current Assignee: Solvay USA, Inc.
- Current Assignee Address: US NJ Cranbury
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L51/00
- IPC: H01L51/00

Abstract:
A composition comprising: at least one compound comprising a hole transporting core, wherein the core is covalently bonded to a first arylamine group and also covalently bonded to a second arylamine group different from the first, and wherein the compound is covalently bonded to at least one intractability group, wherein the intractability group is covalently bonded to the hole transporting core, the first arylamine group, the second arylamine group, or a combination thereof, and wherein the compound has a molecular weight of about 5,000 g/mole or less. Blended mixtures of arylamine compounds, including fluorene core compounds, can provide good film formation and stability when coated onto hole injection layers. Solution processing of OLEDs is a particularly important application.
Public/Granted literature
- US20130344648A1 HOLE TRANSPORT COMPOSITIONS AND RELATED DEVICES AND METHODS (II) Public/Granted day:2013-12-26
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