发明授权
- 专利标题: Semiconductor device and method for manufacturing semiconductor device
- 专利标题(中): 半导体装置及半导体装置的制造方法
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申请号: US13581242申请日: 2011-02-23
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公开(公告)号: US08816324B2公开(公告)日: 2014-08-26
- 发明人: Takashi Fukui , Katsuhiro Tomioka , Junichi Motohisa , Shinjiroh Hara
- 申请人: Takashi Fukui , Katsuhiro Tomioka , Junichi Motohisa , Shinjiroh Hara
- 申请人地址: JP Hokkaido JP Osaka
- 专利权人: National University Corporation Hokkaido University,Sharp Kabushiki Kaisha
- 当前专利权人: National University Corporation Hokkaido University,Sharp Kabushiki Kaisha
- 当前专利权人地址: JP Hokkaido JP Osaka
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP2010-040019 20100225
- 国际申请: PCT/JP2011/053909 WO 20110223
- 国际公布: WO2011/105397 WO 20110901
- 主分类号: H01L29/06
- IPC分类号: H01L29/06
摘要:
Disclosed is a semiconductor device (10) which comprises a glass substrate (12), a lower electrode layer (14), an n-type doped polycrystalline silicon semiconductor layer (16), a low-temperature insulating film (20) in which openings (22, 23) that serve as nuclei for growth of a nanowire (32) are formed, the nanowire (32) that is grown over the low-temperature insulating film (20) and has a core-shell structure, an insulating layer (50) that surrounds the nanowire (32), and an upper electrode layer (52). The nanowire (32) comprises an n-type GaAs core layer and a p-type GaAs shell layer. Alternatively, the nanowire can be formed as a nanowire having a quantum well structure, and InAs that can allow reduction of the process temperature can be used for the nanowire.
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