发明授权
US08816390B2 System and method for an electronic package with a fail-open mechanism
有权
具有故障切换机制的电子封装的系统和方法
- 专利标题： System and method for an electronic package with a fail-open mechanism
- 专利标题（中）： 具有故障切换机制的电子封装的系统和方法
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申请号： US13361742申请日： 2012-01-30
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公开(公告)号： US08816390B2公开(公告)日： 2014-08-26
- 发明人: Carlo Baterna Marbella , Ganesh Vetrivel Periasamy , Kok Kiat Koo , Ai Min Tan
- 申请人： Carlo Baterna Marbella , Ganesh Vetrivel Periasamy , Kok Kiat Koo , Ai Min Tan
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L21/52 ; H01L23/373
摘要：
In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.
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