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公开(公告)号：US20130194752A1
公开(公告)日：2013-08-01
申请号：US13361742
申请日：2012-01-30
IPC分类号： H05K7/20 , H01L21/52 , H01L23/373
CPC分类号： H01L23/34 , H01L23/3121 , H01L23/49562 , H01L23/62 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/29101 , H01L2224/29116 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H05K1/0201 , H05K2201/0311 , H05K2201/10166 , H05K2203/176 , H01L2224/45099 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.
摘要翻译： 根据实施例，半导体封装包括被配置为安装在电路板上的第一表面和可热膨胀材料的区域，该区域被构造成当热电阻的温度推动半导体封装的第一表面远离电路板时 可膨胀材料超过第一温度。
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2.发明授权公开(公告)号：US08816390B2
公开(公告)日：2014-08-26
申请号：US13361742
申请日：2012-01-30
IPC分类号： H05K7/20 , H01L21/52 , H01L23/373
CPC分类号： H01L23/34 , H01L23/3121 , H01L23/49562 , H01L23/62 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/29101 , H01L2224/29116 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H05K1/0201 , H05K2201/0311 , H05K2201/10166 , H05K2203/176 , H01L2224/45099 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.
摘要翻译： 根据实施例，半导体封装包括被配置为安装在电路板上的第一表面和可热膨胀材料的区域，该区域被构造成当热电阻的温度推动半导体封装的第一表面远离电路板时 可膨胀材料超过第一温度。
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