- 专利标题： Device including two semiconductor chips and manufacturing thereof
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申请号： US13013022申请日： 2011-01-25
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公开(公告)号： US08816504B2公开(公告)日： 2014-08-26
- 发明人: Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
- 申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L29/72
- IPC分类号： H01L29/72
摘要：
A device includes a first semiconductor chip with a first contact pad on a first face and a second semiconductor chip with a first contact pad on a first face. The second semiconductor chip is placed over the first semiconductor chip, wherein the first face of the first semiconductor chip faces the first face of the second semiconductor chip. Exactly one layer of an electrically conductive material is arranged between the first semiconductor chip and the second semiconductor chip. The exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip.
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