发明授权
- 专利标题: Paste composition and printed circuit board
- 专利标题(中): 糊状组合物和印刷电路板
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申请号: US13356955申请日: 2012-01-24
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公开(公告)号: US08822048B2公开(公告)日: 2014-09-02
- 发明人: Hirofumi Ebe , Shinichi Inoue , Yoshihiro Furukawa
- 申请人: Hirofumi Ebe , Shinichi Inoue , Yoshihiro Furukawa
- 申请人地址: JP Osaka
- 专利权人: Nitto Denko Corporation
- 当前专利权人: Nitto Denko Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Panitch Schwarze Belisario & Nadel LLP
- 优先权: JP2011-014129 20110126
- 主分类号: H01M2/02
- IPC分类号: H01M2/02 ; H01M14/00 ; H05K5/03 ; B32B33/00
摘要:
A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1).
公开/授权文献
- US20120186865A1 PASTE COMPOSITION AND PRINTED CIRCUIT BOARD 公开/授权日:2012-07-26
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