发明授权
- 专利标题: Interposer having an inductor
- 专利标题(中): 具有电感的插入器
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申请号: US13075059申请日: 2011-03-29
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公开(公告)号: US08823133B2公开(公告)日: 2014-09-02
- 发明人: Michael O. Jenkins , James Karp , Vassili Kireev , Ephrem C. Wu
- 申请人: Michael O. Jenkins , James Karp , Vassili Kireev , Ephrem C. Wu
- 申请人地址: US CA San Jose
- 专利权人: Xilinx, Inc.
- 当前专利权人: Xilinx, Inc.
- 当前专利权人地址: US CA San Jose
- 代理商 W. Eric Webostad; Gerald Chan
- 主分类号: H01L27/08
- IPC分类号: H01L27/08 ; H01L25/18 ; H01L23/60 ; H01L23/64 ; H01L23/498 ; H01L25/065
摘要:
An embodiment of a multichip module is disclosed. For this embodiment of a multichip module, a semiconductor die and an interposer are included. The interposer has conductive layers, dielectric layers, and a substrate. Internal interconnect structures couple the semiconductor die to the interposer. External interconnect structures are for coupling the interposer to an external device. A first inductor includes at least a portion of one or more of the conductive layers of the interposer. A first end of the first inductor is coupled to an internal interconnect structure of the internal interconnect structures. A second end of the first inductor is coupled to an external interconnect structure of the external interconnect structures.
公开/授权文献
- US20120248569A1 INTERPOSER HAVING AN INDUCTOR 公开/授权日:2012-10-04