发明授权
- 专利标题： Electronic package structure
- 专利标题（中）： 电子封装结构
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申请号： US13185573申请日： 2011-07-19
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公开(公告)号： US08824165B2公开(公告)日： 2014-09-02
- 发明人: Da-Jung Chen , Chau-Chun Wen , Chun-Tiao Liu
- 申请人： Da-Jung Chen , Chau-Chun Wen , Chun-Tiao Liu
- 申请人地址： TW Hsinchu
- 专利权人： Cyntec Co. Ltd
- 当前专利权人： Cyntec Co. Ltd
- 当前专利权人地址： TW Hsinchu
- 代理机构： Lowe Hauptman & Ham, LLP
- 优先权： TW97105555A 20080218
- 主分类号： H05K5/02
- IPC分类号： H05K5/02
摘要：
An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
公开/授权文献
- US20120014079A1 ELECTRONIC PACKAGE STRUCTURE 公开/授权日：2012-01-19
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