A liquid resin material molding system includes a mold, a mold clamping device for clamping the mold, and a supply device for supplying a liquid resin material to the mold. The supply device includes an agitation-mixing mechanism for agitation-mixing of a liquid resin material of an additive added to a main component, a pump mechanism for feeding the liquid material mixture obtained thereby, and a fixed-quantity metering/supply mechanism for metering a fixed quantity of the liquid material mixture fed thereto via a first flow passage by the pump mechanism, for intermittent supply to the mold through a second flow passage.