Invention Grant
- Patent Title: Mounting socket for mobile phone
- Patent Title (中): 手机安装插座
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Application No.: US13683892Application Date: 2012-11-21
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Publication No.: US08827749B2Publication Date: 2014-09-09
- Inventor: Jung-Hoon Kim
- Applicant: Jung-Hoon Kim
- Applicant Address: KR Kyungsangbuk-Do
- Assignee: Tyco Electronics Amp Korea Ltd.
- Current Assignee: Tyco Electronics Amp Korea Ltd.
- Current Assignee Address: KR Kyungsangbuk-Do
- Agency: Barley Snyder
- Priority: KR10-2011-0122389 20111122
- Main IPC: H01R24/00
- IPC: H01R24/00 ; G06K7/00 ; H01R12/50 ; H01R27/02 ; H01R13/24

Abstract:
A card mounting socket for a mobile phone having a reduced size and reduced number of parts. The card mounting socket having a body and a separate casing. The body housing includes a first receiving section, a second receiving section and an inner wall. The first receiving section is provided with a pair of guides positioned on both sides thereof and a first card terminal disposed along a major surface of the first receiving section. The second receiving section includes a second card terminal disposed along a major surface of the second receiving section. The inner wall extends perpendicular from the first receiving section to the second receiving section such that the second receiving section is stepped with respect to the first receiving section. The separate casing is secured to an upper portion of the body and separates the first receiving section from the second receiving section.
Public/Granted literature
- US20130171880A1 Mounting Socket For Mobile Phone Public/Granted day:2013-07-04
Information query