Invention Grant
- Patent Title: Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same
- Patent Title (中): 用于液浸曝光的正型抗蚀剂组合物和使用其形成图案的方法
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Application No.: US13782148Application Date: 2013-03-01
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Publication No.: US08828643B2Publication Date: 2014-09-09
- Inventor: Hiromi Kobayashi , Haruki Inabe
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-200679 20040707
- Main IPC: C07C69/54
- IPC: C07C69/54 ; H01L21/027
Abstract:
A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.
Public/Granted literature
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