发明授权
- 专利标题: Die structure and method of fabrication thereof
- 专利标题(中): 模具结构及其制造方法
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申请号: US13328746申请日: 2011-12-16
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公开(公告)号: US08828848B2公开(公告)日: 2014-09-09
- 发明人: Jing-Cheng Lin , Ying-Da Wang , Li-Chung Kuo , Szu Wei Lu
- 申请人: Jing-Cheng Lin , Ying-Da Wang , Li-Chung Kuo , Szu Wei Lu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater and Matsil, L.L.P.
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.
公开/授权文献
- US20130154062A1 Die Structure and Method of Fabrication Thereof 公开/授权日:2013-06-20