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公开(公告)号：US20130154062A1
公开(公告)日：2013-06-20
申请号：US13328746
申请日：2011-12-16
申请人： Jing-Cheng Lin , Ying-Da Wang , Li-Chung Kuo , Szu Wei Lu
发明人： Jing-Cheng Lin , Ying-Da Wang , Li-Chung Kuo , Szu Wei Lu
IPC分类号： H01L23/544 , H01L21/78
CPC分类号： H01L21/563 , H01L21/561 , H01L23/3128 , H01L24/94 , H01L24/97 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2224/05552
摘要： A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.
摘要翻译： 提供具有沿侧壁的凸缘的模具和形成模具的方法。 还提供了一种包装模具的方法。 通过形成具有第一宽度的第一凹口，然后在第一凹口内形成第二凹槽，使得第二凹槽具有小于第一宽度的第二宽度，来切割诸如经处理晶片的基底。 第二凹口延伸穿过衬底，从而切割衬底。 第一宽度和第二宽度之间的宽度差导致沿着骰子的侧壁的凸缘。 骰子可以放置在基底上，例如插入物，以及放置在骰子和基底之间的底部填充物。 凸缘防止或减少底部填充物在相邻骰子之间的距离。 可以在基材上形成模塑料。
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公开(公告)号：US09620430B2
公开(公告)日：2017-04-11
申请号：US13356173
申请日：2012-01-23
申请人： Szu Wei Lu , Ying-Da Wang , Li-Chung Kuo , Jing-Cheng Lin
发明人： Szu Wei Lu , Ying-Da Wang , Li-Chung Kuo , Jing-Cheng Lin
CPC分类号： H01L25/0655 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/78 , H01L23/3135 , H01L23/3178 , H01L23/3185 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L2224/0401 , H01L2224/05569 , H01L2224/0557 , H01L2224/06181 , H01L2224/11464 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83862 , H01L2224/83874 , H01L2224/92125 , H01L2224/93 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/10156 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/12042 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2224/81 , H01L2924/00012 , H01L2224/11 , H01L2924/00 , H01L2224/05552
摘要： A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.
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公开(公告)号：US08828848B2
公开(公告)日：2014-09-09
申请号：US13328746
申请日：2011-12-16
申请人： Jing-Cheng Lin , Ying-Da Wang , Li-Chung Kuo , Szu Wei Lu
发明人： Jing-Cheng Lin , Ying-Da Wang , Li-Chung Kuo , Szu Wei Lu
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L21/561 , H01L23/3128 , H01L24/94 , H01L24/97 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2224/05552
摘要： A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.
摘要翻译： 提供具有沿侧壁的凸缘的模具和形成模具的方法。 还提供了一种包装模具的方法。 通过形成具有第一宽度的第一凹口，然后在第一凹口内形成第二凹槽，使得第二凹槽具有小于第一宽度的第二宽度，来切割诸如经处理晶片的基底。 第二凹口延伸穿过衬底，从而切割衬底。 第一宽度和第二宽度之间的宽度差导致沿着骰子的侧壁的凸缘。 骰子可以放置在基底上，例如插入物，以及放置在骰子和基底之间的底部填充物。 凸缘防止或减少底部填充物在相邻骰子之间的距离。 可以在基材上形成模塑料。
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公开(公告)号：US20130187258A1
公开(公告)日：2013-07-25
申请号：US13356173
申请日：2012-01-23
申请人： Szu Wei Lu , Ying-Da Wang , Li-Chung Kuo , Jing-Cheng Lin
发明人： Szu Wei Lu , Ying-Da Wang , Li-Chung Kuo , Jing-Cheng Lin
CPC分类号： H01L25/0655 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/78 , H01L23/3135 , H01L23/3178 , H01L23/3185 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L2224/0401 , H01L2224/05569 , H01L2224/0557 , H01L2224/06181 , H01L2224/11464 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83862 , H01L2224/83874 , H01L2224/92125 , H01L2224/93 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/10156 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/12042 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2224/81 , H01L2924/00012 , H01L2224/11 , H01L2924/00 , H01L2224/05552
摘要： A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.
摘要翻译： 一种方法包括将第一和第二包装部件接合在第三包装部件的顶表面上，并分配聚合物。 聚合物包括在第一和第三包装部件之间的空间中的第一部分，在第二和第三包装部件之间的空间中的第二部分和第一和第二包装部件之间的间隙中的第三部分。 然后在聚合物上进行固化步骤。 在固化步骤之后，将聚合物的第三部分锯切以在第一和第二包装部件之间形成沟槽。
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公开(公告)号：US08963334B2
公开(公告)日：2015-02-24
申请号：US13221447
申请日：2011-08-30
申请人： Jing-Cheng Lin , Szu Wei Lu , Ying-Ching Shih , Ying-Da Wang , Li-Chung Kuo , Long Hua Lee , Shin-Puu Jeng , Chen-Hua Yu
发明人： Jing-Cheng Lin , Szu Wei Lu , Ying-Ching Shih , Ying-Da Wang , Li-Chung Kuo , Long Hua Lee , Shin-Puu Jeng , Chen-Hua Yu
IPC分类号： H01L23/498 , H01L25/065 , H01L21/683 , H01L23/00 , H01L25/00 , H01L21/768 , H01L21/56 , H01L23/58
CPC分类号： H01L24/81 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L23/49822 , H01L23/49827 , H01L23/5384 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0401 , H01L2224/05569 , H01L2224/0557 , H01L2224/05572 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/06181 , H01L2224/11462 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2924/00014 , H01L2924/01029 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/3512 , H01L2224/81 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface and a second surface opposite the first surface. The substrate has a through substrate via extending from the first surface towards the second surface. The first die is attached to the substrate, and the first die is coupled to the first surface of the substrate. The second die is attached to the substrate, and the second die is coupled to the first surface of the substrate. A first distance is between a first edge of the first die and a first edge of the second die, and the first distance is in a direction parallel to the first surface of the substrate. The first distance is equal to or less than 200 micrometers.
摘要翻译： 实施例是包括基板，第一模具和第二模具的结构。 衬底具有与第一表面相对的第一表面和第二表面。 衬底具有从第一表面延伸到第二表面的通孔衬底。 第一裸片附着在基片上，第一裸片耦合到基片的第一表面。 第二管芯附接到衬底，并且第二管芯耦合到衬底的第一表面。 第一距离在第一管芯的第一边缘和第二管芯的第一边缘之间，并且第一距离在与基板的第一表面平行的方向上。 第一距离等于或小于200微米。
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公开(公告)号：US20130049216A1
公开(公告)日：2013-02-28
申请号：US13221447
申请日：2011-08-30
申请人： Jing-Cheng Lin , Szu Wei Lu , Ying-Ching Shih , Ying-Da Wang , Li-Chung Kuo , Long Hua Lee , Shin-Puu Jeng , Chen-Hua Yu
发明人： Jing-Cheng Lin , Szu Wei Lu , Ying-Ching Shih , Ying-Da Wang , Li-Chung Kuo , Long Hua Lee , Shin-Puu Jeng , Chen-Hua Yu
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L24/81 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L23/49822 , H01L23/49827 , H01L23/5384 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0401 , H01L2224/05569 , H01L2224/0557 , H01L2224/05572 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/06181 , H01L2224/11462 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2924/00014 , H01L2924/01029 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/18161 , H01L2924/3511 , H01L2924/3512 , H01L2224/81 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface and a second surface opposite the first surface. The substrate has a through substrate via extending from the first surface towards the second surface. The first die is attached to the substrate, and the first die is coupled to the first surface of the substrate. The second die is attached to the substrate, and the second die is coupled to the first surface of the substrate. A first distance is between a first edge of the first die and a first edge of the second die, and the first distance is in a direction parallel to the first surface of the substrate. The first distance is equal to or less than 200 micrometers.
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