Invention Grant
- Patent Title: System for manufacturing laminated circuit boards
- Patent Title (中): 叠层电路板制造系统
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Application No.: US14047183Application Date: 2013-10-07
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Publication No.: US08831918B2Publication Date: 2014-09-09
- Inventor: Anthony Faraci , Gary N. Sortino
- Applicant: Anthony Faraci , Gary N. Sortino
- Applicant Address: US NY Islandia
- Assignee: Duetto Integrated Systems, Inc.
- Current Assignee: Duetto Integrated Systems, Inc.
- Current Assignee Address: US NY Islandia
- Agency: Lackenbach Siegel, LLP
- Agent Andrew F. Young, Esq.
- Main IPC: G06F7/60
- IPC: G06F7/60 ; H05K3/46 ; H05K3/00 ; H05K1/02

Abstract:
The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from atop position to the preferred stack orientation employing a preferred four-axis orientation.
Public/Granted literature
- US20140034244A1 SYSTEM FOR MANUFACTURING LAMINTED CIRCUIT BOARDS Public/Granted day:2014-02-06
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