Invention Grant
- Patent Title: Method of mounting an electronic component on a circuit board
- Patent Title (中): 将电子部件安装在电路板上的方法
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Application No.: US13305756Application Date: 2011-11-29
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Publication No.: US08832932B2Publication Date: 2014-09-16
- Inventor: Xiao-Hui Zhou , Hong Li , Ping Li , Rui Li
- Applicant: Xiao-Hui Zhou , Hong Li , Ping Li , Rui Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110176813 20110628
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/14 ; H05K3/00 ; H05K3/36

Abstract:
A printed circuit board assembly (PCBA) includes a printed circuit board (PCB) with through holes, a supporting member standing on the PCB adjacent to the through holes, and an electronic component mounted on the PCB is provided. The electronic component includes a component body and a plurality of conductive leads. Fixing ends of the conductive leads of the electronic component is received in the though hole and electrically and mechanically fixed to the PCB. The component body of the electronic component is supported by the supporting member.
Public/Granted literature
- US20130003331A1 PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD Public/Granted day:2013-01-03
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