发明授权
- 专利标题： Dynamic testing based on thermal and stress conditions
- 专利标题（中）： 基于热和应力条件的动态测试
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申请号： US13082769申请日： 2011-04-08
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公开(公告)号： US08836355B2公开(公告)日： 2014-09-16
- 发明人: Mill-Jer Wang , Ching Nen Peng , Hung-Chih Lin , Hao Chen
- 申请人： Mill-Jer Wang , Ching Nen Peng , Hung-Chih Lin , Hao Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： G01R31/10
- IPC分类号： G01R31/10 ; G01R31/28
摘要：
A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked system comprises a plurality of stacked dies. A temperature of the die is measured. A respective set of test conditions of the die is found from the plurality of sets of test conditions, wherein the set of test conditions corresponds to the temperature. The die is at the temperature using the set of test conditions to generate test results.
公开/授权文献
- US20120256649A1 Dynamic Testing Based on Thermal and Stress Conditions 公开/授权日：2012-10-11
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