Invention Grant
- Patent Title: Opto-electric hybrid board and method of manufacturing same
- Patent Title (中): 光电混合板及其制造方法
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Application No.: US13866273Application Date: 2013-04-19
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Publication No.: US08837874B2Publication Date: 2014-09-16
- Inventor: Yuichi Tsujita , Yasuto Ishimaru , Hiroyuki Hanazono , Naoyuki Tanaka , Yasufumi Yamamoto , Shotaro Masuda , Mayu Ozaki
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Ibaraki-shi
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-106834 20120508
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/43 ; G02B6/122 ; G02B6/136 ; G02B6/138

Abstract:
An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.
Public/Granted literature
- US20130301980A1 OPTO-ELECTRIC HYBRID BOARD AND METHOD OF MANUFACTURING SAME Public/Granted day:2013-11-14
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