Invention Grant
- Patent Title: Illumination apparatus employing light-emitting device package
- Patent Title (中): 采用发光装置封装的照明装置
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Application No.: US13099972Application Date: 2011-05-03
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Publication No.: US08840265B2Publication Date: 2014-09-23
- Inventor: Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
- Applicant: Kyung-mi Moon , Young-hee Song , Ill-heung Choi , Jeong-wook Lee , Young-jin Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0041445 20100503
- Main IPC: F21S4/00
- IPC: F21S4/00 ; F21K99/00 ; F21V29/00 ; F21V23/06
Abstract:
An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
Public/Granted literature
- US08807786B2 Illumination apparatus employing light-emitting device package Public/Granted day:2014-08-19
Information query
