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    BACKLIGHT UNIT INCLUDING COB TYPE LIGHT EMITTING DIODE MODULE
    3.
    发明申请
    BACKLIGHT UNIT INCLUDING COB TYPE LIGHT EMITTING DIODE MODULE 有权
    背光单元，包括COB型发光二极管模块

    公开(公告)号：US20130051069A1

    公开(公告)日：2013-02-28

    申请号：US13594014

    申请日：2012-08-24

    申请人： Kyung Mi MOON ,  Hak Hwan KIM

    发明人： Kyung Mi MOON ,  Hak Hwan KIM

    IPC分类号： F21V8/00 ,  H01L33/58

    CPC分类号： G02B6/0021 ,  G02F1/133615 ,  H01L33/58

    摘要： A backlight unit (BLU) is disclosed. The BLU may include a light emitting diode (LED) module including at least one LED chip mounted on a substrate in a chip-on-board (COB) type, and a light guide panel including an incidence surface configured to receive light emitted from an emission surface of the LED chip and to include at least one insertion recess disposed corresponding to the LED chip, such that the LED chip is bonded to the LED module to be inserted in the insertion recess.

    摘要翻译： 公开了一种背光单元（BLU）。 BLU可以包括发光二极管（LED）模块，其包括安装在基板上（COB）类型的基板上的至少一个LED芯片，以及导光板，其包括入射表面，该入射表面被配置为接收从 并且包括与LED芯片相对设置的至少一个插入凹槽，使得LED芯片被结合到LED模块以插入插入凹部中。

    LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光装置模块及其制造方法

    公开(公告)号：US20120267647A1

    公开(公告)日：2012-10-25

    申请号：US13452561

    申请日：2012-04-20

    申请人： Hak Hwan KIM ,  Kyung Mi Moon ,  Ho Sun Paek ,  Young Hee Song

    发明人： Hak Hwan KIM ,  Kyung Mi Moon ,  Ho Sun Paek ,  Young Hee Song

    IPC分类号： H01L33/50

    CPC分类号： H01L33/502 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

    摘要： A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.

    摘要翻译： 提供了可应用于各种应用的发光器件（LED）模块及其制造方法。 通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量，可以提高价格竞争力。 在制造LED模块的方法中，通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作，可以最小化和简化操作。 可以通过使用金属材料作为基板和凸块来增强散热特性。

    LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
    发光二极管封装及其制造方法

    公开(公告)号：US20120056227A1

    公开(公告)日：2012-03-08

    申请号：US13224658

    申请日：2011-09-02

    申请人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon ,  Gwang Bok Woo

    发明人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon ,  Gwang Bok Woo

    IPC分类号： H01L33/62 ,  H01L33/58

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2933/0075 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.

    摘要翻译： 公开了一种发光二极管（LED）封装。 所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个设置在距离所述散热焊盘一定距离的电极焊盘; 至少一个LED，其安装在所述散热垫上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘的第一腔，并且通过所述封装模具的第一表面部分地暴露所述热垫和所述至少两个电极焊盘，所述第一表面至少在所述第一表面上， 安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露热衬垫和至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

    AC DRIVEN LIGHT EMITTING DEVICE
    10.
    发明申请
    AC DRIVEN LIGHT EMITTING DEVICE 有权
    交流驱动发光装置

    公开(公告)号：US20120043896A1

    公开(公告)日：2012-02-23

    申请号：US13215619

    申请日：2011-08-23

    申请人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon

    发明人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon

    IPC分类号： H05B37/02

    CPC分类号： H05B33/0821 ,  H05B33/0806

    摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.

    摘要翻译： 提供了一种包括串联连接的多个LED阵列的交流（AC）驱动的发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构 当对两端电路施加交流电压时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。 交流驱动发光器件允许从低驱动电压Vf进行操作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。