Resist underlayer composition and process of producing integrated circuit devices using same

Invention Grant

US08841218B2 Resist underlayer composition and process of producing integrated circuit devices using same 有权

Title translation: 抗蚀底层组成和使用其制造集成电路器件的工艺

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Patent Title: Resist underlayer composition and process of producing integrated circuit devices using same
Patent Title (中): 抗蚀底层组成和使用其制造集成电路器件的工艺
Application No.: US13571751

Application Date: 2012-08-10
Publication No.: US08841218B2

Publication Date: 2014-09-23
Inventor: Kwen-Woo Han , Mi-Young Kim , Woo-Jin Lee , Han-Song Lee , Seung-Hee Hong , Sang-Kyun Kim , Jin-Wook Lee
Applicant: Kwen-Woo Han , Mi-Young Kim , Woo-Jin Lee , Han-Song Lee , Seung-Hee Hong , Sang-Kyun Kim , Jin-Wook Lee
Applicant Address: KR Gumi-si, Kygeongsangbuk-do
Assignee: Cheil Industries, Inc.
Current Assignee: Cheil Industries, Inc.
Current Assignee Address: KR Gumi-si, Kygeongsangbuk-do
Agency: Lee & Morse, P.C.
Priority: KR10-2011-0080331 20110811
Main IPC: H01L21/311
IPC: H01L21/311 ; C08L83/06

Resist underlayer composition and process of producing integrated circuit devices using same

Abstract:

A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product of hydrolyzed products produced from a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3.

Abstract(Chinese):

包含溶剂的抗蚀剂底层组合物和由化学式1表示的化合物，由化学式2表示的化合物和由化学式3表示的化合物制备的水解产物的有机硅烷缩聚产物。

Public/Granted literature

US20130037921A1 RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING SAME Public/Granted day:2013-02-14

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3105	......后处理
H01L21/311	.......绝缘层的刻蚀