发明授权
- 专利标题： Room temperature metal direct bonding
- 专利标题（中）： 室温金属直接粘接
-
申请号： US13867928申请日： 2013-04-22
-
公开(公告)号： US08846450B2公开(公告)日： 2014-09-30
- 发明人: Qin-yi Tong , Paul M. Enquist , Anthony Scott Rose
- 申请人： Ziptronix, Inc.
- 申请人地址： US NC Morrisville
- 专利权人： Ziptronix, Inc.
- 当前专利权人： Ziptronix, Inc.
- 当前专利权人地址： US NC Morrisville
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/02 ; H01L23/48 ; H01L23/00 ; H01L21/48 ; B23K20/02 ; H01L25/00
摘要：
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
公开/授权文献
- US20130233473A1 ROOM TEMPERATURE METAL DIRECT BONDING 公开/授权日：2013-09-12
信息查询
IPC分类:
