发明授权
- 专利标题: Transmission device and method for manufacturing same, and wireless transmission device and wireless transmission method
- 专利标题(中): 传输装置及其制造方法,无线传输装置及无线传输方法
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申请号: US13062121申请日: 2009-09-15
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公开(公告)号: US08848389B2公开(公告)日: 2014-09-30
- 发明人: Hirofumi Kawamura , Yasuhiro Okada
- 申请人: Hirofumi Kawamura , Yasuhiro Okada
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Dentons US LLP
- 优先权: JP2008-246510 20080925; JP2009-200116 20090831
- 国际申请: PCT/JP2009/066080 WO 20090915
- 国际公布: WO2010/035660 WO 20100401
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H04B3/52 ; H01P5/107 ; H01P5/02 ; H01P1/04 ; H05K1/14 ; H05K1/02
摘要:
An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.
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