Invention Grant
- Patent Title: Techniques to predict three-dimensional thermal distributions in real-time
- Patent Title (中): 实时预测三维热分布的技术
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Application No.: US12146952Application Date: 2008-06-26
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Publication No.: US08849630B2Publication Date: 2014-09-30
- Inventor: Yasuo Amemiya , Hendrik F. Hamann , Walter Hirt , Ying Hung , Jing Shen
- Applicant: Yasuo Amemiya , Hendrik F. Hamann , Walter Hirt , Ying Hung , Jing Shen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: G06G7/48
- IPC: G06G7/48 ; G06G7/56 ; G06G7/50 ; G06F17/50 ; G06F1/20 ; H05K7/20

Abstract:
Techniques for monitoring and predicting environmental operating conditions in a data center are provided. In one aspect, a method for real-time, three-dimensional analysis of environmental operating conditions in a data center includes the following steps. High spatial resolution three-dimensional measurements of one or more environmental variables in the data center made at a time t1 are obtained. Real-time measurements of the environmental variables in the data center made at a time t2, wherein t2 is later in time than t1, are obtained. The high spatial resolution three-dimensional measurements are combined with the real-time measurements to derive a model for the environmental variables in the data center at the time t2. The model is used to predict three-dimensional distributions of the environmental variables in the data center at the time t2. A base model can be created and used to derive the model for the data center at the time t2.
Public/Granted literature
- US20090326884A1 Techniques to Predict Three-Dimensional Thermal Distributions in Real-Time Public/Granted day:2009-12-31
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