发明授权
US08852986B2 Integrated circuit package system employing resilient member mold system technology
有权
集成电路封装系统采用弹性元件模具系统技术
- 专利标题： Integrated circuit package system employing resilient member mold system technology
- 专利标题（中）： 集成电路封装系统采用弹性元件模具系统技术
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申请号： US11749717申请日： 2007-05-16
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公开(公告)号： US08852986B2公开(公告)日： 2014-10-07
- 发明人: Heap Hoe Kuan , Pei Ee Chua , Seng Guan Chow
- 申请人： Heap Hoe Kuan , Pei Ee Chua , Seng Guan Chow
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/31
- IPC分类号： H01L23/31
摘要：
An integrated circuit package system that includes: providing a support structure including a device and an electrical contact adjacent thereto; providing a mold system having a cavity, a recess channel, a recess integrally connected to the recess channel, and a resilient member that cooperatively engages the recess channel and the recess; engaging the mold system and the support structure with the cavity over the device and the resilient member between the device and the electrical contact; and injecting encapsulation material into the cavity.
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