Invention Grant
- Patent Title: Conducting path
- Patent Title (中): 进路
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Application No.: US13200922Application Date: 2011-10-05
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Publication No.: US08853532B2Publication Date: 2014-10-07
- Inventor: Hirotaka Eshima , Fumihito Oka
- Applicant: Hirotaka Eshima , Fumihito Oka
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2011-011017 20110121
- Main IPC: H01B7/42
- IPC: H01B7/42 ; H02G3/03

Abstract:
A conducting path includes a plurality of cables, and a cable clamp for clamping the plurality of cables together. The cable clamp includes a single metal plate molded along a perimeter of the plurality of cables, an attachment flange formed by overlapping both ends of the metal plate, and a cable supporting member for supporting the plurality of cables between the cable supporting member and the metal plate. The cable supporting member includes a coolant passage formed therein for passing a coolant to cool the plurality of cables in a longitudinal direction of the plurality of cables.
Public/Granted literature
- US20120186845A1 Conducting path Public/Granted day:2012-07-26
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