Invention Grant
- Patent Title: High speed communication jack
- Patent Title (中): 高速通讯插孔
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Application No.: US13739214Application Date: 2013-01-11
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Publication No.: US08858266B2Publication Date: 2014-10-14
- Inventor: Brett D. Robinson
- Applicant: Sentinel Connector Systems, Inc.
- Applicant Address: US PA York
- Assignee: Sentinel Connector Systems, Inc.
- Current Assignee: Sentinel Connector Systems, Inc.
- Current Assignee Address: US PA York
- Agency: Vedder Price P.C.
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R13/646 ; H01R43/20 ; H01R13/6474 ; H01R24/64

Abstract:
A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug and a shielding case surrounding the housing. A flexible circuit board between the shielding case and the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a first side of the substrate, with each trace extending from a corresponding one of the plurality of vias, and a shielding plane on a second side of the substrate opposite the first side of the substrate.
Public/Granted literature
- US20130210277A1 HIGH SPEED COMMUNICATION JACK Public/Granted day:2013-08-15
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