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公开(公告)号：US09627816B2
公开(公告)日：2017-04-18
申请号：US15146019
申请日：2016-05-04
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson , Justin Wagner
IPC: H01R13/658 , H01R13/6581 , H01R13/6474 , H01R24/64 , H01R107/00 , H01R13/66
CPC classification number: H01R13/6581 , H01R13/6474 , H01R13/6658 , H01R24/64 , H01R2107/00 , Y10T29/49165
Abstract: A method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing.
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公开(公告)号：US20200083652A1
公开(公告)日：2020-03-12
申请号：US16681458
申请日：2019-11-12
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
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公开(公告)号：US08858266B2
公开(公告)日：2014-10-14
申请号：US13739214
申请日：2013-01-11
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson
IPC: H01R24/00 , H01R13/646 , H01R43/20 , H01R13/6474 , H01R24/64
CPC classification number: H01R13/646 , H01R13/6474 , H01R13/7195 , H01R24/64 , H01R43/205 , Y10T29/49218
Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug and a shielding case surrounding the housing. A flexible circuit board between the shielding case and the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a first side of the substrate, with each trace extending from a corresponding one of the plurality of vias, and a shielding plane on a second side of the substrate opposite the first side of the substrate.
Abstract translation: 一种高速通信插座，包括：壳体，其包括用于接收插头的端口，所述端口包括多个引脚，每个引脚均连接到插头中的相应信号线;以及围绕外壳的屏蔽壳。 在屏蔽壳体和壳体之间的柔性电路板具有衬底，多个通孔延伸穿过衬底，每个通孔被配置为容纳壳体上的销，衬底的第一侧上的多个迹线，每个 从所述多个通孔中的相应一个延伸的迹线以及在所述基板的与所述基板的所述第一侧相对的第二侧上的屏蔽平面。
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公开(公告)号：US09912448B2
公开(公告)日：2018-03-06
申请号：US14223364
申请日：2014-03-24
Applicant: SENTINEL CONNECTOR SYSTEMS, INC.
Inventor： Brett D. Robinson
IPC: H04L1/24 , H04B17/00 , H01R13/6474 , H01R13/6469 , H05K1/02 , H01R24/64 , G01R1/04
CPC classification number: H04L1/24 , G01R1/0416 , H01R13/6469 , H01R13/6474 , H01R24/64 , H04B17/00 , H05K1/025 , H05K1/0268 , H05K1/0366 , H05K2201/09027 , H05K2201/10189
Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate.
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公开(公告)号：US20210391670A1
公开(公告)日：2021-12-16
申请号：US17396311
申请日：2021-08-06
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson
IPC: H01R13/646 , H01R43/20 , H01R13/6474 , H01R13/7195 , H01R13/66 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
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Patent Agency Ranking
公开(公告)号：US11088494B2
公开(公告)日：2021-08-10
申请号：US16681458
申请日：2019-11-12
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson
IPC: H01R13/64 , H01R13/646 , H01R43/20 , H01R13/6474 , H01R13/7195 , H01R13/66 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H01R24/64 , H01R13/6581 , H01R107/00
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
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公开(公告)号：US10483702B2
公开(公告)日：2019-11-19
申请号：US16192139
申请日：2018-11-15
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson
IPC: H01R24/64 , H01R13/6474 , H01R13/66 , H01R43/20 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H01R13/6581 , H01R107/00
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
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公开(公告)号：US20190089105A1
公开(公告)日：2019-03-21
申请号：US16192139
申请日：2018-11-15
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson
IPC: H01R24/64 , H05K1/02 , H05K1/16 , H05K1/11 , H01R13/66 , H01R13/6474 , H05K1/09 , H01R43/20 , H01R13/6581 , H01R107/00
CPC classification number: H01R24/64 , H01R13/6474 , H01R13/6581 , H01R13/6625 , H01R13/6658 , H01R43/205 , H01R2107/00 , H05K1/0218 , H05K1/0228 , H05K1/09 , H05K1/115 , H05K1/162 , Y10T29/49165
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
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公开(公告)号：US10141698B2
公开(公告)日：2018-11-27
申请号：US15146008
申请日：2016-05-04
Applicant: Sentinel Connector Systems, Inc.
Inventor： Brett D. Robinson
IPC: H01R24/64 , H01R13/6474 , H01R43/20 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H01R13/6581 , H01R13/66 , H01R107/00
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
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10.发明授权公开(公告)号：US10014990B2
公开(公告)日：2018-07-03
申请号：US14223405
申请日：2014-03-24
Applicant: SENTINEL CONNECTOR SYSTEMS, INC.
Inventor： Brett D. Robinson
IPC: H04L1/24 , H01R13/6474 , H01R13/6469 , H05K1/02 , H01R24/64 , G01R1/04
CPC classification number: H04L1/24 , G01R1/0416 , H01R13/6469 , H01R13/6474 , H01R24/64 , H05K1/0228 , H05K1/025 , H05K2201/09027 , H05K2201/09236 , H05K2201/10189
Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate and terminating at an end point, a plurality of termination points adjacent to the end points of the pin traces, a plurality of end traces having a height and a width with each end trace extending from an end point of a respective pin trace towards to a corresponding termination point near to the pin trace, a plurality of traces extending from the end of a respective end point or termination point to the edge of the substrate.
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