Invention Grant
- Patent Title: System and method for step coverage measurement
- Patent Title (中): 步骤覆盖测量的系统和方法
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Application No.: US13914848Application Date: 2013-06-11
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Publication No.: US08859301B2Publication Date: 2014-10-14
- Inventor: Hanhong Chen , Edward Haywood , Pragati Kumar
- Applicant: Intermolecular, Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/66 ; G01N23/223

Abstract:
Determining an unknown step coverage of a thin film deposited on a 3D wafer includes exposing a planar wafer comprising a first film deposited thereon to X-ray radiation to create first fluorescent radiation; detecting the first fluorescent radiation; measuring a number of XRF counts on the planar wafer; creating an XRF model of the planar wafer; providing a portion of the 3D wafer comprising troughs and a second film deposited thereon; determining a multiplier factor between the portion of the 3D wafer and the planar wafer; exposing the portion of the 3D wafer to X-ray radiation to create second fluorescent radiation; detecting the second fluorescent radiation; measuring a number of XRF counts on the portion of the 3D wafer; calculating a step coverage of the portion of the 3D wafer; and determining a uniformity of the 3D wafer based on the step coverage of the portion of the 3D wafer.
Public/Granted literature
- US20130272496A1 System and Method for Step Coverage Measurement Public/Granted day:2013-10-17
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