发明授权
- 专利标题: High voltage device and manufacturing method thereof
- 专利标题(中): 高压器件及其制造方法
-
申请号: US14056613申请日: 2013-10-17
-
公开(公告)号: US08859373B2公开(公告)日: 2014-10-14
- 发明人: Tsung-Yi Huang , Chien-Wei Chiu
- 申请人: Tsung-Yi Huang , Chien-Wei Chiu
- 申请人地址: TW Chupei, Hsin-Chu
- 专利权人: Richtek Technology Corporation, R.O.C.
- 当前专利权人: Richtek Technology Corporation, R.O.C.
- 当前专利权人地址: TW Chupei, Hsin-Chu
- 代理机构: Tung & Associates
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/06 ; H01L29/78 ; H01L29/10
摘要:
The present invention discloses a high voltage device and a manufacturing method thereof. The high voltage device is formed in a substrate. The high voltage device includes: a gate, a source and drain, a drift region, and a mitigation region. The gate is formed on an upper surface of the substrate. The source and drain are located at both sides of the gate below the upper surface respectively, and the source and drain are separated by the gate. The drift region is located at least between the gate and the drain. The mitigation region is formed below the drift region, and the drift region has an edge closer to the source. A vertical distance between this edge of the drift region and the mitigation region is less than or equal to five times of a depth of the drift region.
公开/授权文献
- US20140045314A1 HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2014-02-13