Invention Grant
- Patent Title: Gate electrode(s) and contact structure(s), and methods of fabrication thereof
- Patent Title (中): 栅电极和接触结构及其制造方法
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Application No.: US13733282Application Date: 2013-01-03
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Publication No.: US08859417B2Publication Date: 2014-10-14
- Inventor: Jialin Yu , Huang Liu , Jilin Xia
- Applicant: GLOBALFOUNDRIES, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Kevin P. Radigan, Esq.
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L23/52 ; H01L23/48 ; H01L29/40 ; H01L29/45

Abstract:
A conductive structure(s), such as a gate electrode(s) or a contact structure(s), and methods of fabrication thereof are provided. The conductive structure(s) includes a first conductive layer of a first conductive material, and a second conductive layer of a second conductive material. The second conductive layer is disposed over the first conductive layer, and at least a portion of the first conductive material includes grains having a size larger than a defined value, and at least a second portion of the second conductive material includes grains having a size less than the defined value. In one embodiment, the first and second conductive materials are the same conductive material, with different-sized grains.
Public/Granted literature
- US20140183745A1 GATE ELECTRODE(S) AND CONTACT STRUCTURE(S), AND METHODS OF FABRICATION THEREOF Public/Granted day:2014-07-03
Information query
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