发明授权
- 专利标题： Printed circuit board and method of manufacturing the same
- 专利标题（中）： 印刷电路板及其制造方法
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申请号： US13213939申请日： 2011-08-19
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公开(公告)号： US08865393B2公开(公告)日： 2014-10-21
- 发明人: Dae Jo Hong , Chang Sup Ryu , Cheol Ho Choi
- 申请人： Dae Jo Hong , Chang Sup Ryu , Cheol Ho Choi
- 申请人地址： KR Gyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Gyunggi-Do
- 代理机构： Bracewell & Giuliani LLP
- 代理商 Brad Y. Chin
- 优先权： KR10-2010-0080925 20100820
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; H05K3/30 ; H01L21/48 ; H01L23/498 ; H01L21/56 ; H05K3/28 ; H05K3/34 ; H01L23/00
摘要：
Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film.
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