发明授权
- 专利标题： Fan-out package comprising bulk metal
- 专利标题（中）： 包括散装金属的扇出包装
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申请号： US13604239申请日： 2012-09-05
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公开(公告)号： US08866285B2公开(公告)日： 2014-10-21
- 发明人: Yen-Chang Hu , Chang-Chia Huang , Ching-Wen Hsiao , Chen-Shien Chen
- 申请人： Yen-Chang Hu , Chang-Chia Huang , Ching-Wen Hsiao , Chen-Shien Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/52
摘要：
A device includes a polymer, a device die in the polymer, and a plurality of Through Assembly Vias (TAVs) extending from a top surface to a bottom surface of the polymer. A bulk metal feature is located in the polymer and having a top-view size greater than a top-view size of each of the plurality of TAVs. The bulk metal feature is electrically floating. The polymer, the device die, the plurality of TAVs, and the bulk metal feature are portions of a package.
公开/授权文献
- US20140061937A1 Fan-Out Package Comprising Bulk Metal 公开/授权日：2014-03-06