发明授权
- 专利标题： Bonding process and bonded structures
- 专利标题（中）： 粘结工艺和粘结结构
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申请号： US13344070申请日： 2012-01-05
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公开(公告)号： US08866289B2公开(公告)日： 2014-10-21
- 发明人: Thorbjorn Ebefors , Edward Kalvesten , Niklas Svedin , Anders Eriksson
- 申请人： Thorbjorn Ebefors , Edward Kalvesten , Niklas Svedin , Anders Eriksson
- 申请人地址： SE Jarfalla
- 专利权人： Silex Microsystems AB
- 当前专利权人： Silex Microsystems AB
- 当前专利权人地址： SE Jarfalla
- 代理机构： Young & Thompson
- 优先权： SE0900590 20090430
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/12 ; B81C1/00 ; H01L23/00
摘要：
A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described.
公开/授权文献
- US20120112335A1 NOVEL BONDING PROCESS AND BONDED STRUCTURES 公开/授权日：2012-05-10
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