Invention Grant
- Patent Title: Package systems having interposers with interconnection structures
- Patent Title (中): 具有互连结构的插入器的封装系统
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Application No.: US12781960Application Date: 2010-05-18
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Publication No.: US08866301B2Publication Date: 2014-10-21
- Inventor: Yung-Chi Lin , Jing-Cheng Lin , Chen-Hua Yu
- Applicant: Yung-Chi Lin , Jing-Cheng Lin , Chen-Hua Yu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/02 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L23/29 ; H01L21/48
Abstract:
A package system includes a first integrated circuit disposed over an interposer. The interposer includes at least one molding compound layer including a plurality of electrical connection structures through the at least one molding compound layer. A first interconnect structure is disposed over a first surface of the at least one molding compound layer and electrically coupled with the plurality of electrical connection structures. The first integrated circuit is electrically coupled with the first interconnect structure.
Public/Granted literature
- US20110285005A1 PACKAGE SYSTEMS HAVING INTERPOSERS Public/Granted day:2011-11-24
Information query
IPC分类:
