发明授权
- 专利标题： Integrated circuit having stack structure
- 专利标题（中）： 具有堆叠结构的集成电路
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申请号： US13961067申请日： 2013-08-07
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公开(公告)号： US08866543B2公开(公告)日： 2014-10-21
- 发明人: Chang Kun Park , Ho Yong Hwang
- 申请人： Soongsil University Research Consortium Techno-Park
- 申请人地址： KR Seoul
- 专利权人： Soongsil University Research Consortium Techno-Park
- 当前专利权人： Soongsil University Research Consortium Techno-Park
- 当前专利权人地址： KR Seoul
- 代理机构： Sherr & Jiang, PLLC
- 优先权： KR10-2012-0132977 20121122
- 主分类号： H01L25/00
- IPC分类号： H01L25/00 ; G05F3/16 ; H01L25/065
摘要：
Provided is an integrated circuit (IC) having a stacked structure. The IC includes: a first IC having a power input terminal to which a power supply voltage is applied; and a second IC having a power input terminal connected to a ground terminal of the first IC, having a central node formed as the power input terminal of the second IC and the ground terminal of the first IC are connected to each other and to which a voltage is applied, and having a ground terminal connected to a ground source, wherein the power supply voltage is divided into first and second voltages that are respectively applied to the first and second ICs.
公开/授权文献
- US20140139271A1 INTEGRATED CIRCUIT HAVING STACK STRUCTURE 公开/授权日：2014-05-22
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