发明授权
- 专利标题: Copper alloy plate and method for producing same
- 专利标题(中): 铜合金板及其制造方法
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申请号: US12624472申请日: 2009-11-24
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公开(公告)号: US08871041B2公开(公告)日: 2014-10-28
- 发明人: Weilin Gao , Hisashi Suda , Hiroto Narieda , Akira Sugawara
- 申请人: Weilin Gao , Hisashi Suda , Hiroto Narieda , Akira Sugawara
- 申请人地址: JP Tokyo
- 专利权人: Dowa Metaltech Co., Ltd.
- 当前专利权人: Dowa Metaltech Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Bachman & LaPointe, P.C.
- 优先权: JP2008-303688 20081128
- 主分类号: C22C9/06
- IPC分类号: C22C9/06 ; C22C9/00 ; C22F1/08
摘要:
A sheet material of a copper alloy has a chemical composition including 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.
公开/授权文献
- US20100132851A1 COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME 公开/授权日:2010-06-03
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