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发明授权
US08871862B2 Molding compound on the basis of a copolyamide containing terephthalic acid and trimethylhexamethylene diamine units 有权
基于含有对苯二甲酸和三甲基六亚甲基二胺单元的共聚酰胺的成型化合物

Molding compound on the basis of a copolyamide containing terephthalic acid and trimethylhexamethylene diamine units
摘要：
A molding compound, containing at least 30% by weight of a copolyamide, which is derived from the following monomers: a) 50 to 95 mole percent of the combination of a diamine, selected from the group consisting of 1,9-nonane diamine, 1,10-decane diamine, 1,11-undecane diamine and 1,12-dodecane diamine, and terephthalic acid, and b) 5 to 50 mole percent of the combination of a diamine, selected from the group consisting of 2,2,4-trimethylhexamethylene diamine, 2,4,4-trimethylhexamethylene diamine, and mixtures thereof, and terephthalic acid. The copolyamide is crystalline and has low water absorption.
摘要（中）：

含有至少30重量％的共聚酰胺的模制化合物，其衍生自以下单体：a）50-95摩尔％的二胺的组合，其选自1,9-壬二胺， 1,10-癸烷二胺，1,11-十一烷二胺和1,12-十二烷二胺和对苯二甲酸，以及b）5至50摩尔％的二胺的组合，其选自2,2， 4-三甲基六亚甲基二胺，2,4,4-三甲基六亚甲基二胺及其混合物和对苯二甲酸。 共聚酰胺是结晶的，吸水率低。

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