发明授权
- 专利标题: Three dimensional (3D) fan-out packaging mechanisms
- 专利标题(中): 三维(3D)扇出包装机制
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申请号: US13597868申请日: 2012-08-29
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公开(公告)号: US08872326B2公开(公告)日: 2014-10-28
- 发明人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung
- 申请人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung
- 申请人地址: TW
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW
- 代理机构: Lowe Hauptman & Ham, LLP
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
The mechanisms of forming a semiconductor device package described above provide a low-cost manufacturing process due to the relative simple process flow. By forming an interconnecting structure with a redistribution layer(s) to enable bonding of one or more dies underneath a package structure, the warpage of the overall package is greatly reduced. In addition, interconnecting structure is formed without using a molding compound, which reduces particle contamination. The reduction of warpage and particle contamination improves yield. Further, the semiconductor device package formed has low form factor with one or more dies fit underneath a space between a package structure and an interconnecting structure.
公开/授权文献
- US20140061888A1 THREE DIMENSIONAL (3D) FAN-OUT PACKAGING MECHANISMS 公开/授权日:2014-03-06