A liquid jetting apparatus includes: a liquid jetting head in which nozzles for jetting the liquid are formed and which has an actuator for jetting the liquid from the nozzles; an interposer substrate which is provided to the liquid jetting head and on which a driver IC is mounted; a control substrate which controls the liquid jetting head; a wire member which connects the interposer substrate and the control substrate; and a flexible circuit board which connects the interposer substrate and the actuator, wherein the interposer substrate has a first connecting portion to which the wire member is to be connected, and a second connecting portion to which the flexible circuit board is to be connected, and the driver IC is arranged nearer to the first connecting portion than the second connecting portion of the interposer substrate.