Invention Grant
- Patent Title: Method for assembling heat generating element and heat dissipating element, pressure sensitive element, and power supplying unit
- Patent Title (中): 用于组装发热元件和散热元件，压敏元件和供电单元的方法
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Application No.: US13942893Application Date: 2013-07-16
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Publication No.: US08877560B2Publication Date: 2014-11-04
- Inventor: Wen-Chi Chen , Ming-Feng Tang , Chung-Fu Wang
- Applicant: Lite-On Technology Corp.
- Applicant Address: TW Taipei
- Assignee: Lite-On Technology Corp.
- Current Assignee: Lite-On Technology Corp.
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN201210370598 20120928
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B32B9/00 ; B32B33/00 ; B32B27/12 ; C09J7/02 ; H05K13/00 ; H01L23/373 ; H01L21/48 ; H05K7/20 ; H01L23/40
Abstract:
A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.
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