Invention Grant
- Patent Title: Methods of forming field effect transistors on substrates
- Patent Title (中): 在衬底上形成场效应晶体管的方法
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Application No.: US13865117Application Date: 2013-04-17
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Publication No.: US08877589B2Publication Date: 2014-11-04
- Inventor: Robert J. Hanson , Sanh D. Tang
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L21/8234 ; H01L29/66 ; H01L21/265

Abstract:
The invention includes methods of forming field effect transistors. In one implementation, the invention encompasses a method of forming a field effect transistor on a substrate, where the field effect transistor comprises a pair of conductively doped source/drain regions, a channel region received intermediate the pair of source/drain regions, and a transistor gate received operably proximate the channel region. Such implementation includes conducting a dopant activation anneal of the pair of source/drain regions prior to depositing material from which a conductive portion of the transistor gate is made. Other aspects and implementations are contemplated.
Public/Granted literature
- US20130230957A1 Methods of Forming Field Effect Transistors on Substrates Public/Granted day:2013-09-05
Information query
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