发明授权
US08877645B2 Integrated circuit structure having selectively formed metal cap
有权
具有选择性地形成的金属盖的集成电路结构
- 专利标题: Integrated circuit structure having selectively formed metal cap
- 专利标题(中): 具有选择性地形成的金属盖的集成电路结构
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申请号: US13233064申请日: 2011-09-15
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公开(公告)号: US08877645B2公开(公告)日: 2014-11-04
- 发明人: Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
- 申请人: Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Hoffman Warnick LLC
- 代理商 Yuanmin Cai
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L23/48 ; H01L29/78
摘要:
Methods of forming an integrated circuit structure utilizing a selectively formed and at least partially oxidized metal cap over a gate, and associated structures. In one embodiment, a method includes providing a precursor structure including a transistor having a metal gate; forming an etch stop layer over an exposed portion of the metal gate; at least partially oxidizing the etch stop layer; and forming a dielectric layer over the at least partially oxidized etch stop layer.
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