Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
- Patent Title (中): 基板处理方法和基板处理装置
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Application No.: US13729069Application Date: 2012-12-28
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Publication No.: US08877653B2Publication Date: 2014-11-04
- Inventor: Takahiro Yamaguchi , Akio Hashizume , Yuya Akanishi , Takashi Ota
- Applicant: Dainippon Screen Mfg. Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2012-002772 20120111
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; H01L21/00 ; B44C1/22
Abstract:
A solvent vapor containing a solvent material capable of dissolving hydrogen fluoride is supplied to a surface of a substrate, thereby covering the surface of the substrate with a liquid film containing solvent material. Thereafter an etching vapor containing a hydrogen fluoride is supplied to the surface of the substrate covered by the liquid film containing the solvent material, thereby etching the surface of the substrate.
Public/Granted literature
- US20130175241A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2013-07-11
Information query
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