发明授权
- 专利标题： Probe pad design for 3DIC package yield analysis
- 专利标题（中）： 探针垫设计，用于3DIC封装产量分析
-
申请号： US13272004申请日： 2011-10-12
-
公开(公告)号： US08878182B2公开(公告)日： 2014-11-04
- 发明人: Tzu-Yu Wang , Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Hsien-Pin Hu , Wei-Cheng Wu , Li-Han Hsu , Meng-Han Lee
- 申请人： Tzu-Yu Wang , Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Hsien-Pin Hu , Wei-Cheng Wu , Li-Han Hsu , Meng-Han Lee
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/66 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L23/31
摘要：
An interposer includes a first surface on a first side of the interposer and a second surface on a second side of the interposer, wherein the first and the second sides are opposite sides. A first probe pad is disposed at the first surface. An electrical connector is disposed at the first surface, wherein the electrical connector is configured to be used for bonding. A through-via is disposed in the interposer. Front-side connections are disposed on the first side of the interposer, wherein the front-side connections electrically couple the through-via to the probe pad.
公开/授权文献
- US20130092935A1 Probe Pad Design for 3DIC Package Yield Analysis 公开/授权日：2013-04-18
信息查询
IPC分类:
