Invention Grant
- Patent Title: Method and apparatus for monitoring semiconductor fabrication
- Patent Title (中): 用于监控半导体制造的方法和装置
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Application No.: US13831101Application Date: 2013-03-14
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Publication No.: US08878183B2Publication Date: 2014-11-04
- Inventor: Randy Yach
- Applicant: Microchip Technology Incorporated
- Applicant Address: US AZ Chandler
- Assignee: Microchip Technology Incorporated
- Current Assignee: Microchip Technology Incorporated
- Current Assignee Address: US AZ Chandler
- Agency: King & Spalding L.L.P.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/66
Abstract:
A semiconductor chip for process monitoring of semiconductor fabrication, has a plurality of arrays with a plurality of diodes, each diode being formed in the chip, each diode being associated with a stack with at least one horizontal interconnect, the stack and the diode connected in series to form a diode stack combination, wherein the horizontal interconnect has a salicided polysilicon interconnect comprising complementary doped polysilicon sections to form a reverse biased diode.
Public/Granted literature
- US20140264333A1 METHOD AND APPARATUS FOR MONITORING SEMICONDUCTOR FABRICATION Public/Granted day:2014-09-18
Information query
IPC分类:
