Invention Grant
- Patent Title: Buried channel transistor and method of forming the same
- Patent Title (中): 掩埋沟道晶体管及其形成方法
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Application No.: US13770573Application Date: 2013-02-19
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Publication No.: US08878299B2Publication Date: 2014-11-04
- Inventor: Ki-Seok Lee , Dae-Ik Kim
- Applicant: Samsung Electronics Co. Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2012-0050828 20120514
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/78 ; H01L21/8234

Abstract:
A semiconductor device may include a plurality of memory cells. The memory cells may be formed with respective fin shaped active regions with respective recesses formed therein. Thicknesses of the fins may be made relatively thicker around the recesses, such as by selective epitaxial growth around the recesses. The additional thicknesses may be asymmetrical so that portions of the fin on one side are larger than an opposite side. Related methods and systems are also disclosed.
Public/Granted literature
- US20130299834A1 BURIED CHANNEL TRANSISTOR AND METHOD OF FORMING THE SAME Public/Granted day:2013-11-14
Information query
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